PROCESS
Advanced Sintering & Specialty Welding
Two technical centers support R&D prototyping, pilot validation, and batch toll processing across semiconductor and advanced-material applications.
TECH CENTER
Advanced Sintering Technology Center
Review process windows, suitable materials, equipment routes, and quote entry points by technology center.
Spark Plasma Sintering (SPS)
Rapid densification using pulsed current and axial pressure at lower temperatures with fine-grained microstructures.
5
Advantages
3
Equipment
Vacuum Hot Pressing Sintering
Simultaneous pressure and high-temperature heating in vacuum for near-net-shape densification.
5
Advantages
3
Equipment
Hot Isostatic Pressing (HIP)
Isotropic high-pressure densification eliminating internal porosity and defects.
5
Advantages
1
Equipment
Gas Pressure Sintering (GPS)
High-pressure inert gas sintering inhibiting decomposition for high density and refined microstructure.
4
Advantages
1
Equipment
Hydrogen Atmosphere Sintering
High-purity hydrogen reduction for oxide removal, purification and surface activation.
4
Advantages
2
Equipment
Vacuum/Atmosphere/Debinding Sintering
Integrated debinding and sintering in vacuum with excellent batch consistency.
5
Advantages
2
Equipment
TECH CENTER
Specialty Welding Technology Center
Review process windows, suitable materials, equipment routes, and quote entry points by technology center.
Vacuum Diffusion Bonding
Solid-state atomic diffusion bonding without filler metal, minimal deformation and excellent hermeticity.
5
Advantages
3
Equipment
Vacuum Brazing
Capillary-filled metallurgical bonding in high vacuum with minimal deformation and excellent sealing.
6
Advantages
2
Equipment
Hydrogen Brazing (HB)
Hydrogen atmosphere brazing for clean, consistent joints on precision metal and metallized ceramic assemblies.
4
Advantages
-
Equipment
Spark Plasma Bonding (SB)
High energy density plasma arc welding for precision metal joining and hermetic structures.
4
Advantages
-
Equipment