Typical Pain Points

• Thermal-management material densification
• Packaging weld hermeticity
• High-purity and high-density sputtering targets

Typical Products

• Copper-diamond and aluminum-diamond thermal-management substrates
• AMB brazed IGBT power modules
• Liquid-cooled thermal-management plates and cold plates
• High-purity sputtering targets (Ta, Mo, Cu, TiAl)

Typical Pain Points

• High-temperature alloy densification
• Dissimilar-material joining
• Structural fatigue-life improvement

Typical Products

• Titanium alloy and superalloy structural parts
• Functional gradient materials such as stainless steel / zirconia
• Precision aerospace components
• High-reliability joined assemblies

Typical Pain Points

• Ultra-hard ceramic densification
• Materials for extreme environments
• Precision hermetic joining

Typical Products

• SiC and B4C armor ceramics
• Precision metal structural parts
• Vacuum hermetic assemblies

Typical Pain Points

• Power-device thermal management
• High-purity battery materials
• Magnetic material densification

Typical Products

• Thermal-management substrates and modules
• Rare-earth magnetic materials such as Nd-Fe-B
• Battery and energy-material components

Typical Pain Points

• Precision small-part batch consistency
• MIM debinding and sintering
• Compact thermal-management components

Typical Products

• MIM stainless-steel precision parts
• Wear-resistant small components
• Miniature packaging and thermal components

Typical Pain Points

• Tool-material densification
• Wear resistance improvement
• Large-size component validation

Typical Products

• WC-Co cemented carbide tools
• PCD and CBN superhard tools
• Wear-resistant structural parts